Nanoparticles: Copper [Cu]
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| Basic characteristics: | ||||||
|---|---|---|---|---|---|---|
| Name: | Copper nanoparticles | |||||
| Packaging: | Antistatic plastic bags | |||||
| Molecular Formula: | Cu | |||||
| Appearance: | Brown to black powder | |||||
| Applications: | ||||||
| Conductive coatings | Due to its high conductivity and surface area, copper nanoparticles can be used for EMI shielding and heat sinks. | |||||
| Efficient catalyst | Cu nanoparticles can serve as catalysts for chemical reactions. Copper can be used as a catalyst for the synthesis of methanol and glycol. | |||||
| Conductive inks and pastes | Conductive paste and ink from copper can be used as a replacement for more expensive noble metals for printed electronics, displays and other transmissive conductive thin film applications. | |||||
| Attributes: | ||||||
| Product name |
Average particle size [nm] |
Diameter Range [nm] |
Purity [%] |
Specific surface area [m2/g] |
Bulk density [g/cm3] |
Shape |
| Copper | 45 | <100 | 99+ | 30-50 | 0.30-0.35 | Round |
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| Images: | ||||||
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| Copper Nanoparticles | Size distribution(nm) | |||||