ANI Aluminum Pastes
ANI’s aluminum pastes are tailored for conductive applications in the silicon photovoltaics industry. Without the use of glass frits, our Al-iP3000 paste can achieve diffusion through passivation layers on silicon wafers. This lead-free and cadmium-free 50wt% paste with small particle sizes allows for non-contact application including spray coating and direct-print that are compatible with next generation thin (180μm) Si wafer technologies. The paste is printed and thermally cured to form conductive patterns with excellent adhesion and BSF layer formation.
| Preliminary Specifications: | |
|---|---|
| Particle size | Nanometric to <3μm |
| Resistivity | 5-3 mΩ/sq |
| Solid content | 40 wt%* |
| Viscosity | 11,000 cP** |
| Solvent | Organic |
| Composition | Pb and Cd free, Glass frit free |
| Back Surface Field thickness | 8-24 µm*** |
* Available from 10-40 wt% |
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Inquiries
If you have an application or development program that would benefit from our pastes and inks and printing expertise, please fill out our Information Request Form or contact us at sales(at)appliednanotech.net.